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FS150R06KE3 Infineon IGBT

FS150R06KE3

  • Model: FS150R06KE3
  • 87 Units in Stock
  • Manufactured by: Infineon

Description of FS150R06KE3

Description

Powerex IGBTMOD™ Modules are designed for use in switching applications. Each module consists of six IGBT Transistors in a three phase bridge configuration, with each transistor having a reverseconnected super-fast recovery free-wheel diode. All components and interconnects are isolated from the heat sinking baseplate, offering simplified system assembly and thermal management.

Key Parameters Thermal and Mechanical Characteristics, Tj = 25 °C unless otherwise specified

CharacteristicsSymbolTest ConditionsMin.Typ.Max.Units
Thermal Resistance, Junction to CaseRth(j-c)QPer IGBT 1/6 Module, Tc Reference
Point per Outline Drawing
––0.35°C/W
Thermal Resistance, Junction to CaseRth(j-c)DPer FWDi 1/6 Module, Tc Reference
Point per Outline Drawing
–
–
0.70°C/W
Thermal Resistance, Junction to CaseRth(j-c)'QPer IGBT 1/6 Module,
Tc Reference Point Under Chip
–0.23 °C/W
Contact Thermal ResistanceRth(c-f)Per Module, Thermal Grease Applied
–
0.018
–
°C/W

*TC, Tf measured point is just under the chips.


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